Patent Assignment
Reel/Frame 061701/0791
Assignment of Assignor's Interest
Recorded: 2022-11-09
Pages: 5
Assignors
CHEN, YI-HSIU
Executed: 2022-07-20
WANG, SHAO-AN
Executed: 2022-07-29
SANO, KENICHI
Executed: 2022-07-19
KELLY, ANDREW JOSEPH
Executed: 2022-09-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Gap Filling Method in Semiconductor Manufacturing Process