Patent Assignment
Reel/Frame 061717/0270
Assignment of Assignor's Interest
Recorded: 2022-11-10
Pages: 5
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 28602, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including Interposer
Application:
18/054,225 →
Publication:
US 2023/0178469