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Patent Assignment
Reel/Frame 061718/0617

Assignment of Assignor's Interest

Recorded: 2022-11-10 Pages: 8
Assignors
YOU, HYEONGYU
Executed: 2022-07-25
DO, JUNGHO
Executed: 2022-07-25
PARK, SANGDO
Executed: 2022-07-25
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property (1)
Integrated Circuit and Method of Manufacturing the Same
Application: 17/984,417 →
Publication: US 2023/0142050