IP Library › Assignment 061726/0307
Patent Assignment
Reel/Frame 061726/0307

Assignment of Assignor's Interest

Recorded: 2022-11-10 Pages: 4
Assignors
CHEN, WEI-FAN
Executed: 2022-10-24
TSAI, KUO-CHI
Executed: 2022-10-24
Assignee
LEAP SEMICONDUCTOR CORP.
3F, NO.86-7, YIWEN 1ST ST., TAOYUAN DIST.,, TAOYUAN CITY, 33045, TAIWAN
Covered Property (1)
Temperature Sensing Device
Application: 17/979,743 →
Publication: US 2024/0102869