IP Library › Assignment 061729/0317
Patent Assignment
Reel/Frame 061729/0317

Assignment of Assignor's Interest

Recorded: 2022-10-20 Pages: 3
Assignor
BURTON, EDWARD
Executed: 2019-08-08
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Stacked Semiconductor Die Architecture with Multiple Layers of Disaggregation
Application: 16/646,974 →
Publication: US 2020/0219843