Patent Assignment
Reel/Frame 061736/0256
Assignment of Assignor's Interest
Recorded: 2022-11-11
Pages: 3
Assignee
CHENGDU PBM TECHNOLOGY LTD.
ROOM 3, FLOOR 11, UNIT 1, BUILDING 5, NO. 399 WEST OF FUCHENG ROAD, HI-TECH DISTRICT, CHENGDU, SICHUAN, 610041, CHINA
Covered Property
(1)
High-Density Three-Dimensional Multilayer Memory and Fabrication Method