Patent Assignment
Reel/Frame 061746/0799
Assignment of Assignor's Interest
Recorded: 2022-11-13
Pages: 2
Assignor
MURAKAMI, HIDEAKI
Executed: 2022-09-05
Assignee
KIOXIA CORPORATION
1-21 SHIBAURA 3-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Device and Manufacturing Method of Semiconductor Device