IP Library Assignment 061806/0471
Patent Assignment
Reel/Frame 061806/0471

Assignment of Assignor's Interest

Recorded: 2022-11-17 Pages: 6
Assignors
LER, HUI MIN
Executed: 2020-12-11
WANG, SOON WEI
Executed: 2020-12-14
CHEW, CHEE HIONG
Executed: 2020-12-11
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MD A700, PHOENIX, ARIZONA, 85008
Covered Property (1)
Semiconductor Package with Wettable Flank
Application: 18/056,304 →
Publication: US 2023/0073330
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Feb 24, 2023
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 062882/0265 →
Release of Security Interest in Patents Previously Recorded at Reel 062882, Frame 0265 Aug 16, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 064615/0423 →