Patent Assignment
Reel/Frame 064615/0423
Release of Security Interest in Patents Previously Recorded at Reel 062882, Frame 0265
Recorded: 2023-08-16
Pages: 22
Assignor
DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Executed: 2023-08-16
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 EAST MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Properties
(59)
Backside Metal Patterning Die Singulation Systems and Related Methods
Soi Substrate and Related Methods
Breakdown Voltage Improvement in Vertical Trench-Gate Devices
Application:
17/938,096 →
Publication:
US 2023/0113308
Dual-Channel Acoustic Distance Measurement Circuit and Method
Patent:
11,899,106 →
Application:
17/938,191 →
Reference Pixel Column Readout
Body Brake Control for Multistage Power Converter
Method and System of a Quasi-Constant on-Time Controller
Power System Having Multi-Trigger All-Phase Activation
Image Sensor with Active Capacitance Cancellation Circuitry to Reduce Pixel Output Settling Time
Multi-Segment Wire-Bond
Improved Seals for Semiconductor Devices with Single-Photon Avalanche Diode Pixels
Application:
18/051,600 →
Publication:
US 2024/0145504
Transistors with Selectively Landed Gate Array
Application:
18/053,177 →
Publication:
US 2024/0153850
Wap Uplink Optimization by Selection of Mimo Antennas Spatial States
Semiconductor Crystal Growth Using Source Powder from Crucible Wall
Application:
18/053,796 →
Publication:
US 2024/0150926
Semiconductor Device Package Assemblies Having a Pre-Applied Thermally Conductive Adhesive
Application:
18/054,229 →
Publication:
US 2024/0162110
Multi-Link Wireless Communications Connections
Power Electronics Package with Dual-Single Side Cooling Water Jacket
Application:
18/055,123 →
Publication:
US 2024/0162117
Package Including Multiple Semiconductor Devices
Semiconductor Package with Wettable Flank and Related Methods
Semiconductor Package with Wettable Flank
Power Module Package with Molded via and Dual Side Press-Fit Pin
Application:
18/056,442 →
Publication:
US 2024/0170378
Optical Sensor Transparent Cover with Array Contact Grid
Image Sensors Having Data Converters with Low Noise Comparators
Circuitry and Methods for Mitigating Imbalance in Image Sensors with Multiple Readout Paths
Automated Power Discrete and Module Model Generation for System Level Simulators
Application:
18/058,382 →
Publication:
US 2024/0169136
Semiconductor Devices and Methods of Manufacturing Semiconductor Devices
Circuitry and Methods for Mitigating Gradient Effects in Image Sensors
Stacked Power Terminals in a Power Electronics Module
Image Sensors with Multiple Column Output Lines Per Column
Semiconductor Devices with Dissimlar Materials and Methods
Beamformer Solicited Sounding
Battery Pack Controller and Control Method
Application:
18/062,903 →
Publication:
US 2024/0195286
Imaging Systems with Distributed and Delay-Locked Control
Patent:
11,943,553 →
Application:
18/062,920 →
Up-Diffusion Suppression in a Power Mosfet
Advanced Dual Band Virtual Concurrent for Wifi
Imaging Systems, and Image Pixels and Related Methods
Application:
18/065,992 →
Publication:
US 2023/0230987
Self-Aligned Jfet Device
Application:
18/066,738 →
Publication:
US 2024/0204111
Image Sensors Having High Dynamic Range Pixels
Semiconductor Structures and Methods of Manufacturing Semiconductor Structures
Methods and Systems of Current Sensing in Switching Power Converters
Temperature Resistant Contact Unit Holder Receptacle Assembly and Related Methods
Methods of Forming Semiconductor Packages with Back Side Metal
Methods and Apparatus for Repetitive Histogramming
Methods and Apparatus for a Time-to-Digital Converter
Battery Backup Capacity Detection
Application:
18/146,504 →
Publication:
US 2024/0213554
Anti-Blooming Control in Overflow Image Sensor Pixel
Application:
18/148,558 →
Publication:
US 2023/0282677
Power Module Package
Patent:
1,098,055 →
Application:
29/861,844 →
Transfer Molded Direct Cooling Module
Application:
63/378,391 →
Black Mask on Glass Configurations
Application:
63/378,457 →
Module Structure Using an Integrated Substrate
Application:
63/378,628 →
Power Module Package Having Mirrored Leads
Application:
63/379,387 →
Embedded Power Module Package
Application:
63/379,853 →
Semiconductor Device with Stacked Conductive Layers and Enhanced Gate Connectivity and Related Methods
Application:
63/379,993 →
Transfer Molded Power Module Package
Application:
63/380,460 →
Efficient Power Module Package
Application:
63/380,528 →
Voltage Regulator
Application:
63/381,274 →
Efficient Power Module
Application:
63/383,837 →
Molded Power Module Package
Application:
63/383,932 →
Visible and Cqd Swir Sensor
Application:
63/414,182 →
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 3, 2022
From: SEDDON, MICHAEL J.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 061286/0392 →
Assignment of Assignor's Interest
Oct 4, 2022
From: SEDDON, MICHAEL J.; GRISWOLD, MARK
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 061306/0385 →
Assignment of Assignor's Interest
Oct 5, 2022
From: COWLEY, NICHOLAS PAUL; TALBOT, ANDREW DAVID
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 061322/0278 →
Assignment of Assignor's Interest
Oct 5, 2022
From: HUSTAVA, MAREK; KOSTELNIK, PAVEL
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 061321/0665 →
Assignment of Assignor's Interest
Oct 6, 2022
From: LEONE, SALVATORE; ZAFARANA, ALESSANDRO
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 061333/0720 →
Assignment of Assignor's Interest
Oct 11, 2022
From: SPILLANE, MARGARET; BURKE, KIERAN; DILLON, GARY
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 061379/0731 →
Assignment of Assignor's Interest
Oct 12, 2022
From: RAMAKRISHNAN, SHANKAR
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 061395/0305 →
Assignment of Assignor's Interest
Oct 13, 2022
From: ZAFARANA, ALESSANDRO
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 061408/0142 →
Assignment of Assignor's Interest
Oct 21, 2022
From: PADMANABHAN, BAL; VENKATRAMAN, PRASAD; CHOWDHURY, SAUVIK
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 061492/0677 →
Assignment of Assignor's Interest
Nov 1, 2022
From: BAYRON, ELMER CUNANAN
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 061609/0341 →
Assignment of Assignor's Interest
Nov 1, 2022
From: GAMBINO, JEFFREY PETER; JEROME, RICK CARLTON; PRICE, DAVID T.; KEYES, MICHAEL GERARD
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 061611/0408 →
Assignment of Assignor's Interest
Nov 7, 2022
From: FRANCHI, JIMMY ROBERT HANNES; GUMAELIUS, KRISTER; AN, JAEIN
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 061677/0611 →
Assignment of Assignor's Interest
Nov 8, 2022
From: DEHGHAN, HOSSEIN; SCHELSTRAETE, SIGURD
To: QUANTENNA COMMUNICATIONS, INC.
Reel/Frame 061695/0850 →
Assignment of Assignor's Interest
Nov 9, 2022
From: JESKO, RADEK; VALEK, LUKAS; TESIK, JAN
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 061703/0308 →
Assignment of Assignor's Interest
Nov 10, 2022
From: IM, SEUNGWON; KIM, JEUNGDAE; JEON, OSEOB; LEE, BYOUNGOK
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 061717/0623 →
Assignment of Assignor's Interest
Nov 11, 2022
From: WANG, HUIZHAO
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 061732/0420 →
Assignment of Assignor's Interest
Nov 14, 2022
From: TEYSSEYRE, JEROME; ESTACIO, MARIA CRISTINA; IM, SEUNGWON
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 061760/0804 →
Assignment of Assignor's Interest
Nov 14, 2022
From: LEE, YOONSOO; IM, SEUNGWON; JEON, OSEOB
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 061760/0263 →
Assignment of Assignor's Interest
Nov 16, 2022
From: LER, HUI MIN; WANG, SOON WEI; CHEW, CHEE HIONG
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 061797/0929 →
Security Interest
Feb 24, 2023
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 062882/0265 →
Assignment of Assignor's Interest
Apr 6, 2023
From: ON SEMICONDUCTOR CONNECTIVITY SOLUTIONS, INC.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 063280/0591 →
Merger and Change of Name
Apr 6, 2023
From: RAPTOR OPERATIONS SUB, INC.; QUANTENNA COMMUNICATIONS, INC.
To: ON SEMICONDUCTOR CONNECTIVITY SOLUTIONS, INC.
Reel/Frame 063271/0657 →
Release of Security Interest
May 2, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 063516/0756 →
Assignment of Assignor's Interest
May 8, 2023
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: MAXLINEAR, INC.
Reel/Frame 063572/0701 →
Security Interest
Jul 13, 2023
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; GTAT CORPORATION
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064271/0971 →