IP Library › Assignment 061306/0385
Patent Assignment
Reel/Frame 061306/0385

Assignment of Assignor's Interest

Recorded: 2022-10-04 Pages: 4
Assignors
SEDDON, MICHAEL J.
Executed: 2018-04-24
GRISWOLD, MARK
Executed: 2018-04-20
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MD A700, PHOENIX, ARIZONA, 85008
Covered Property (1)
Soi Substrate and Related Methods
Application: 17/937,918 →
Publication: US 2023/0025410
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Feb 24, 2023
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 062882/0265 →
Release of Security Interest in Patents Previously Recorded at Reel 062882, Frame 0265 Aug 16, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 064615/0423 →