POWER ELECTRONICS PACKAGE WITH DUAL-SINGLE SIDE COOLING WATER JACKET
A package includes a frame having a cooling fluid channel therethrough. The frame has at least one opening in a first sidewall alongside the cooling fluid channel and at least one opening in a second sidewall alongside the cooling fluid channel. A first power electronics module covers the at least one opening in the first sidewall with a surface of a substrate in the first power electronics module being exposed to the cooling fluid channel in the frame through the at least one opening in the first sidewall, and a second power electronics module covers the at least one opening in the second sidewall with a surface of a substrate in the second electronics module being exposed to the cooling fluid channel in the frame through the at least one opening in the second sidewall.
1 . A package comprising:
a frame having a first sidewall and a second sidewall opposite the first sidewall, the frame having at least one opening in the first sidewall and at least one opening in the second sidewall;
a first power electronics module covering the at least one opening in the first sidewall with a surface of a substrate in the first power electronics module being exposed to an interior of the frame through the at least one opening in the first sidewall; and
a second power electronics module covering the at least one opening in the second sidewall with a surface of a substrate in the second power electronics module being exposed to an interior of the frame through the at least one opening in the second sidewall,
the first sidewall, the surface of the substrate of the first power electronics module, the second sidewall, and the surface of the substrate of the second power electronics module collectively defining a cooling fluid channel through the frame.
2 . The package of claim 1 , wherein the surface of the substrate in the first power electronics module is a first surface of the substrate, and the first power electronics module is a single side direct cooled (SSDC) package including a power semiconductor device mounted on a second surface of the substrate opposite the first surface of the substrate.
3 . The package of claim 1 , further comprising:
an inlet port disposed at a first end of the frame; and
an outlet port disposed at a second end of the frame opposite the first end.
4 . The package of claim 1 , wherein the surface of the substrate in the first power electronics module covering the at least one opening seals the at least one opening in the first sidewall alongside the cooling fluid channel.
5 . The package of claim 4 , wherein an O-ring-and-groove arrangement is disposed around a perimeter of the at least one opening in the first sidewall to seal the at least one opening.
6 . The package of claim 4 , an adhesive sealant is disposed around a perimeter of the at least one opening in the first sidewall to seal the at least one opening.
7 . The package of claim 1 , wherein a baseplate is attached to the surface of the substrate of the first power electronics module exposed to the cooling fluid channel in the frame and the baseplate includes at least one pin fin extending from the baseplate into the cooling fluid channel.
8 . The package of claim 7 , wherein the at least one pin fin has a teardrop-like shape or includes a truncated cone portion.
9 . The package of claim 1 , wherein the first power electronics module includes a first baseplate having at least a first pin fin extending therefrom into the cooling fluid channel and the second power electronics module includes a second baseplate having at least a second pin fin extending therefrom into the cooling fluid channel, and wherein the first baseplate and the second baseplate are aligned so that so that a top end surface of the first pin fin touches a top end surface of the second pin fin.
10 . The package of claim 1 , wherein the first power electronics module includes a first baseplate having at least a first pin fin extending therefrom into the cooling fluid channel and the second power electronics module includes a second baseplate having at least a second pin fin extending therefrom into the cooling fluid channel, and wherein the first baseplate and the second baseplate are aligned so that so that a top end surface of the first pin fin are separated by a distance no greater than 10% percent of a pin height.
11 . A package comprising:
a frame having a cooling fluid channel therethrough, the cooling fluid channel being formed between a first sidewall and a second sidewall opposite the first sidewall, the frame including a first plurality of openings disposed in a first row in the first sidewall alongside the cooling fluid channel and a second plurality of openings disposed in a second row in the second sidewall alongside the cooling fluid channel opposite the first sidewall;
a first plurality of power electronics modules disposed alongside the first sidewall over the first plurality of openings in the first sidewall with each of the first plurality of openings exposing a surface of a substrate in a corresponding one of the first plurality of power electronics modules to the cooling fluid channel in the frame; and
a second plurality of power electronics modules disposed alongside the second sidewall over the second plurality of openings in the second sidewall with each of the second plurality of openings exposing a surface of a substrate in a corresponding one of the second plurality of power electronics modules to the cooling fluid channel in the frame.
12 . The package of claim 11 , wherein a baseplate with pin fins is attached to the surface of the substrate in each of the first plurality of power electronics modules and the surface of the substrate in each of the second plurality of power electronics modules being exposed to the cooling fluid channel in the frame.
13 . The package of claim 11 , wherein each of the first plurality of power electronics modules and each of the second plurality of power electronics modules is a single side direct cooled (SSDC) package including a power semiconductor device mounted on a surface of the substrate opposite the surface of the substrate exposed to the cooling fluid channel in the frame.
14 . The package of claim 11 , wherein the first plurality of power electronics modules and the second plurality of power electronics modules each include three single side direct cooled (SSDC) packages.
15 . A method, comprising:
forming a cooling fluid channel between a first sidewall and a second sidewall in a frame, the frame having at least one opening in the first sidewall alongside the cooling fluid channel and at least one opening in the second sidewall alongside the cooling fluid channel;
disposing a first power electronics module to cover the at least one opening in the first sidewall with a surface of a substrate in the first power electronics module being exposed to the cooling fluid channel in the frame through the at least one opening in the first sidewall; and
disposing a second power electronics module to cover the at least one opening in the second sidewall with a surface of a substrate in the second power electronics module being exposed to the cooling fluid channel in the frame through the at least one opening in the second sidewall.
16 . The method of claim 15 , wherein forming the cooling fluid channel includes disposing an inlet port at a first end of the frame and an outlet port at a second end of the frame opposite the first end.
17 . The method of claim 16 , wherein disposing the first power electronics module to cover the at least one opening in the first sidewall includes sealing of the at least one opening in the first sidewall by the surface of the substrate in the first power electronics module.
18 . The method of claim 17 , wherein sealing of the at least one opening in the first sidewall by the surface of the substrate in the first power electronics module includes disposing an O-ring-and-groove arrangement around a perimeter of the at least one opening in the first sidewall alongside the cooling fluid channel.
19 . The method of claim 17 , wherein sealing of the at least one opening in the first sidewall by the surface of the substrate in the first power electronics module includes disposing an adhesive around a perimeter of the at least one opening in the first sidewall alongside the cooling fluid channel.
20 . The method of claim 15 , wherein disposing the first power electronics module to cover the at least one opening in the first sidewall includes attaching a baseplate to the surface of the substrate in the first power electronics module and exposing the baseplate to the cooling fluid channel in the frame, and wherein the baseplate includes at least one pin fin extending from the baseplate into the cooling fluid channel.
21 . The method of claim 20 , wherein the at least one pin fin has a teardrop-like shape or includes a truncated cone portion.
22 . The method of claim 15 , wherein the first power electronics module includes a first baseplate having at least a first pin fin extending therefrom into the cooling fluid channel and the second power electronics module includes a second baseplate having at least a second pin fin extending therefrom into the cooling fluid channel, and wherein the method further includes aligning the first power electronics module and the second power electronics module so that so that a top end surface of at least the first pin fin touches a top end surface of at least the second pin fin.
23 . The method of claim 15 , wherein the first power electronics module includes a first baseplate having at least a first pin fin extending therefrom into the cooling fluid channel and the second power electronics module includes a second baseplate having at least a second pin fin extending therefrom into the cooling fluid channel, and wherein the method further includes aligning the first power electronics module and the second power electronics module so that so that a top end surface of the at least first pin fin and a top end surface of the at least second pin fin are separated by a distance no greater than 10% percent of a pin height.
24 . A package comprising:
a frame having a cooling fluid channel therethrough, the cooling fluid channel being formed between a first sidewall and a second sidewall opposite the first sidewall, the frame having at least one opening in the first sidewall alongside the cooling fluid channel and at least one opening in the second sidewall alongside the cooling fluid channel;
a first power electronics module covering the at least one opening in the first sidewall with a surface of a substrate in the first power electronics module being exposed to the cooling fluid channel in the frame through the at least one opening in the first sidewall; and
a second power electronics module covering the at least one opening in the second sidewall with a surface of a substrate in the second electronics module being exposed to the cooling fluid channel in the frame through the at least one opening in the second sidewall.