Patent Application
Provisional
App. No. 63/379,387
· Confirmation No. 7093
POWER MODULE PACKAGE HAVING MIRRORED LEADS
Applicant:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2022-10-19 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2022-10-13 | SPEC |
Specification | 12 | View | |
| 2022-10-13 | CLM |
Claims | 2 | View | |
| 2022-10-13 | ABST |
Abstract | 1 | View | |
| 2022-10-13 | DRW |
Drawings-only black and white line drawings | 7 | View | |
| 2022-10-13 | ADS |
Application Data Sheet | 9 | View | |
| 2022-10-13 | N417 |
Electronic Filing System Acknowledgment Receipt | 3 | View | |
| 2022-10-13 | N417.PYMT |
Electronic Fee Payment | 2 | View | |
| 2022-10-13 | SPEC |
Specification | — | View |
Inventors
Seungwon IM
Seoul, KOREA, REPUBLIC OF
Jeonghyuk PARK
Incheon, KOREA, REPUBLIC OF
Keunhyuk LEE
Suzhou, CHINA
Jerome TEYSSEYRE
Scottsdale, AZ
Paolo BILARDO
Munich, GERMANY
Attorneys & Agents of Record
Prosecution
- Customer No.
- 14912
- Docket No.
- ONS04715L01US
- Confirmation No.
- 7093
No recorded assignments were found for this patent.
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Quick Facts
- App. No.
- 63/379,387
- Filed
- 2022-10-13
External Links