IP Library › Granted Patent US 1,098,055
Granted Patent S1
US 1,098,055 · App. 29/861,844 · Granted Oct 14, 2025

Power module package

Inventors: Seungwon Im (Seoul, KR); Jeonghyuk Park (Incheon, KR); Keunhyuk Lee (Suzhou, CN); Jerome Teysseyre (Scottsdale, AZ); Paolo Bilardo (Munich, DE)
Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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Quick Facts
Patent No.
US 1,098,055
App. No.
29/861,844
Granted
Oct 14, 2025
Kind
S1
Claims (1)

The ornamental design for a power module package, as shown and described.

Assignments (3)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL 062882, FRAME 0265 Recorded Aug 16, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 064615/0423 →
SECURITY INTEREST Recorded Feb 24, 2023
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 062882/0265 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 9, 2023
From: IM, SEUNGWON; PARK, JEONGHYUK; LEE, KEUNHYUK; TEYSSEYRE, JEROME; BILARDO, PAOLO
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 062315/0889 →