Patent Assignment
Reel/Frame 062315/0889
Assignment of Assignor's Interest
Recorded: 2023-01-09
Pages: 8
Assignors
IM, SEUNGWON
Executed: 2022-12-11
PARK, JEONGHYUK
Executed: 2022-12-06
LEE, KEUNHYUK
Executed: 2022-12-12
TEYSSEYRE, JEROME
Executed: 2023-01-06
BILARDO, PAOLO
Executed: 2022-12-05
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Power Module Package
Patent:
1,098,055 →
Application:
29/861,844 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Feb 24, 2023
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 062882/0265 →
Release of Security Interest in Patents Previously Recorded at Reel 062882, Frame 0265
Aug 16, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 064615/0423 →