Temperature resistant contact unit holder receptacle assembly and related methods
A contact unit holder (CUH) receptacle assembly and a method of manufacturing the CUH receptacle assembly are disclosed, where the receptacle assembly includes a receptacle cover removably attached to a receptacle base. The device may include a receptacle housing extending from an inner surface of the receptacle base to an inner surface of the receptacle cover, a through-hole defined by the receptacle housing, the through-hole extending from an outer surface of the receptacle base to the inner surface of the receptacle cover, and a receptacle pin disposed in the through-hole and protruding from the outer surface of the receptacle base, the receptacle pin being configured to contact a semiconductor device under test (DUT).
1. A contact unit holder (CUH) receptacle assembly comprising:
a receptacle cover removably attached to a receptacle base, the receptacle base including a receptacle housing extending from an inner surface of the receptacle base to an inner surface of the receptacle cover;
a through-hole defined by the receptacle housing, the through-hole extending from an outer surface of the receptacle base to the inner surface of the receptacle cover; and
a receptacle pin disposed within the through-hole and protruding through a seal at the outer surface of the receptacle base to connect a semiconductor device under test (DUT) and a loadboard, the seal configured to prevent leakage into the through-hole to the loadboard.
2. The CUH receptacle assembly of claim 1 , wherein the through-hole comprises a first bore of a first diameter disposed proximal to the receptacle cover and a second bore of second diameter disposed distal to the receptacle cover, and the first diameter being greater than the second diameter.
3. The CUH receptacle assembly of claim 2 , further comprising an opening formed in the receptacle cover to correspond with the through-hole, and a diameter of the opening being substantially similar to the first diameter.
4. The CUH receptacle assembly of claim 3 , wherein a conical flare defines an end of the opening at an outer surface of the receptacle cover.
5. The CUH receptacle assembly of claim 4 , wherein a diameter of the conical flare at the outer surface of the receptacle cover is greater than a diameter of the conical flare inside the receptacle cover, and the diameter of the conical flare inside the receptacle cover is less than the diameter of the opening.
6. The CUH receptacle assembly of claim 2 , wherein the receptacle pin comprises a first cylindrical portion and a second cylindrical portion, and a diameter of the first cylindrical portion being greater than a diameter of the second cylindrical portion.
7. The CUH receptacle assembly of claim 6 , wherein the first cylindrical portion is configured to be slidable in the first bore and the second cylindrical portion is configured to be slidable in the second bore.
8. The CUH receptacle assembly of claim 1 , wherein the seal fills an opening of the through-hole around the receptacle pin.
9. The CUH receptacle assembly of claim 8 , further comprising a receptacle base cover removably attached to the receptacle base, the receptacle base cover configured to affix the seal to the outer surface of the receptacle base.
10. The CUH receptacle assembly of claim 1 , wherein the receptacle cover is removably attached to the receptacle base using at least one screw passing through a plane of the receptacle cover and a plane of the receptacle base.
11. The CUH receptacle assembly of claim 1 , further comprising a recessed channel formed around an outer perimeter of the receptacle housing.
12. The CUH receptacle assembly of claim 1 , wherein the through-hole is precision cut.
13. The CUH receptacle assembly of claim 1 , wherein the seal comprises a Silicon rubber seal.
14. A method of manufacturing a contact unit holder (CUH) receptacle assembly, the method comprising:
removably attaching a receptacle cover to a receptacle base;
forming a receptacle housing extending from an inner surface of the receptacle base to an inner surface of the receptacle cover;
forming a through-hole in the receptacle housing, the through-hole extending from an outer surface of the receptacle base to the inner surface of the receptacle cover; and
disposing a receptacle pin within the through-hole, the receptacle pin protruding through a seal at the outer surface of the receptacle base to to connect a semiconductor device under test (DUT) and a loadboard, the seal configured to block air at the semiconductor device DUT from leaking into the through-hole.
15. The method of manufacturing of claim 14 , wherein the forming of the through-hole comprises forming a first bore of a first diameter distal to the receptacle cover and forming a second bore of second diameter proximal to the receptacle cover, and the first diameter being greater than the second diameter.
16. The method of manufacturing of claim 15 , further comprising forming an orifice in the receptacle cover to correspond with the through-hole, and a diameter of the orifice being substantially similar to the first diameter.
17. The method of manufacturing of claim 16 , further comprising forming a conical flare in the orifice at an outer surface of the receptacle cover.