Patent Assignment
Reel/Frame 061797/0929
Assignment of Assignor's Interest
Recorded: 2022-11-16
Pages: 6
Assignors
LER, HUI MIN
Executed: 2020-12-11
WANG, SOON WEI
Executed: 2020-12-14
CHEW, CHEE HIONG
Executed: 2020-12-11
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MD A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Semiconductor Package with Wettable Flank and Related Methods
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Feb 24, 2023
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 062882/0265 →
Release of Security Interest in Patents Previously Recorded at Reel 062882, Frame 0265
Aug 16, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 064615/0423 →