Patent Assignment
Reel/Frame 061818/0693
Assignment of Assignor's Interest
Recorded: 2022-11-18
Pages: 7
Assignors
BAEK, BONG KWAN
Executed: 2022-11-16
LIM, JUN HYUK
Executed: 2022-11-16
CHUN, JUNG HWAN
Executed: 2022-11-16
HAN, KYU-HEE
Executed: 2022-11-16
BAEK, JONG MIN
Executed: 2022-11-16
RYU, KOUNG MIN
Executed: 2022-11-16
SHIN, JUNG HOO
Executed: 2022-11-16
JANG, SANG SHIN
Executed: 2022-11-16
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Devices and Methods for Fabricating the Same