Patent Assignment
Reel/Frame 061892/0556
Assignment of Assignor's Interest
Recorded: 2022-11-28
Pages: 4
Assignors
CHEN, CHEN-SHIEN
Executed: 2022-11-13
CHEN, HSU-HSIEN
Executed: 2022-11-13
HUANG, YU-CHIH
Executed: 2022-11-21
KUO, TING-HAO
Executed: 2022-11-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Method of Forming Same