Patent Assignment
Reel/Frame 061893/0358
Assignment of Assignor's Interest
Recorded: 2022-11-28
Pages: 4
Assignors
AIZAWA, HIROKAZU
Executed: 2022-11-23
YU, KAI-HUNG
Executed: 2022-11-22
JOY, NICHOLAS
Executed: 2022-11-22
YOSHIDA, YUSUKE
Executed: 2022-11-23
TAPILY, KANDABARA
Executed: 2022-11-22
Assignee
TOKYO ELECTRON LIMITED
AKASAKA BIZ TOWER, 3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Method of Conductive Material Deposition