Patent Assignment
Reel/Frame 061913/0947
Assignment of Assignor's Interest
Recorded: 2022-11-29
Pages: 3
Assignor
DUDOVITCH, OFER
Executed: 2022-11-29
Assignee
APPLIED MATERIALS ISRAEL LTD.
9 OPPENHEIMER STREET, REHOVOT, 7670109, ISRAEL
Covered Property
(1)
Method and System of Operating Substrate Processing by Calculating Wafer Thickness Out of Wafer Mapping Process