Patent Assignment
Reel/Frame 061921/0458
Assignment of Assignor's Interest
Recorded: 2022-11-30
Pages: 6
Assignors
BYUN, YEA RIN
Executed: 2022-10-18
KIM, IN KWON
Executed: 2022-10-18
KIM, SANG KYUN
Executed: 2022-10-18
LEE, HYO SAN
Executed: 2022-10-18
HWANG, BYUNG KEUN
Executed: 2022-10-18
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Slurry Compositions for Polishing Metal Layers, Chemical Mechanical Polishing Apparatuses Using the Same, and Methods for Fabricating Semiconductor Devices Using the Same
Application:
18/060,120 →
Publication:
US 2023/0193080