Patent Assignment
Reel/Frame 061947/0602
Assignment of Assignor's Interest
Recorded: 2022-12-01
Pages: 4
Assignor
MARGALIT, MORDEHAI
Executed: 2012-01-06
Assignee
VIAGAN LTD
21 HASHITA ST., ZICHRON YAAQOV, 30900, ISRAEL
Covered Properties
(13)
Light Emitting Diode Package and Method of Manufacture
Light Emitting Diode Package and Method of Manufacture
Light Emitting Diode Package and Method of Manufacture
Light Emitting Diode Package and Method of Manufacture
Communication Method and Communication Device Using Same
Application:
14/951,627 →
Publication:
US 2016/0156875
Light Emitting Diode Package
Application:
61/449,685 →
Light Emitting Diode Package
Application:
61/449,686 →
Light Emitting Diode Package and Method of Manufacture
Application:
90/015,090 →
Light Emitting Diode Package and Method of Manufacture
Application:
90/015,092 →
Light Emitting Diode Package and Method of Manufacture
Application:
90/015,130 →
Light Emitting Diode Package and Method of Manufacture
Application:
90/015,155 →
Light Emitting Diode Package and Method of Manufacture
Application:
90/015,156 →
Light Emitting Diode Package and Method of Manufacture
Application:
90/015,161 →
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 25, 2015
From: ZHANG, XUE-QIN
To: FU TAI HUA INDUSTRY (SHENZHEN) CO., LTD.; HON HAI PRECISION INDUSTRY CO., LTD.
Reel/Frame 037138/0344 →
Assignment of Assignor's Interest
Mar 23, 2021
From: VIAGAN
To: LED WAFER SOLUTIONS LLC
Reel/Frame 055688/0361 →
Assignment of Assignor's Interest
Dec 1, 2022
From: MARGALIT, MORDEHAI
To: VIAGAN LTD
Reel/Frame 061947/0509 →
Assignment of Assignor's Interest
Dec 1, 2022
From: MARGALIT, MORDEHAI
To: VIAGAN LTD
Reel/Frame 061947/0692 →
Assignment of Assignor's Interest
Dec 1, 2022
From: MARGALIT, MORDEHAI
To: VIAGAN LTD
Reel/Frame 061947/0755 →
Assignment of Assignor's Interest
Dec 1, 2022
From: MARGALIT, MORDEHAI
To: VIAGAN LTD
Reel/Frame 061947/0846 →