Patent Assignment
Reel/Frame 061953/0136
Assignment of Assignor's Interest
Recorded: 2022-12-02
Pages: 7
Assignors
LEE, DOOHYUN
Executed: 2022-07-19
SHIN, HEONJONG
Executed: 2022-07-19
KIM, SEONBAE
Executed: 2022-07-19
PARK, JINYOUNG
Executed: 2022-07-19
PARK, HYUNHO
Executed: 2022-07-19
YU, JIMIN
Executed: 2022-07-20
JANG, JAERAN
Executed: 2022-07-20
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Transistor Devices Having Buried Interconnection Line Below Source/Drain Regions and One or More Protective Layers Covering Lower Surfaces of Gate Structures