Patent Assignment
Reel/Frame 061976/0765
Assignment of Assignor's Interest
Recorded: 2022-12-05
Pages: 6
Assignors
KIM, KI-OK
Executed: 2022-11-21
LEE, JINGON
Executed: 2022-11-21
LIM, MIJEONG
Executed: 2022-11-21
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Temperature Margin Setting Method for 3D Integrated Circuit
Application:
18/061,636 →
Publication:
US 2023/0385497