Patent Assignment
Reel/Frame 061980/0602
Assignment of Assignor's Interest
Recorded: 2022-12-05
Pages: 6
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Substrate Processing Apparatus Including Edge Ring Assembly and Substrate Processing Method Using the Same
Application:
18/075,081 →
Publication:
US 2023/0207281