Patent Assignment
Reel/Frame 062000/0400
Assignment of Assignor's Interest
Recorded: 2022-12-06
Pages: 6
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Package-on-Package Having Different Wiring Insulating Layers Surrounding Differential Signal Wiring Layers