Patent Assignment
Reel/Frame 062036/0550
Assignment of Assignor's Interest
Recorded: 2022-12-09
Pages: 10
Assignee
KOKUSAI ELECTRIC CORPORATION
3-4, KANDAKAJI-CHO, CHIYODA-KU, TOKYO, 101-0045, JAPAN
Covered Property
(1)
Method of Processing Substrate, Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium