Patent Assignment
Reel/Frame 062046/0314
Assignment of Assignor's Interest
Recorded: 2022-12-09
Pages: 3
Assignee
LX SEMICON CO., LTD
222, TECHNO2-RO, YUSEONG-GU, DAEJEON, 34027, KOREA, REPUBLIC OF
Covered Property
(1)
Double-Sided Heat Dissipation Power Semiconductor Module and Method of Manufacturing the Same
Application:
18/078,767 →
Publication:
US 2023/0187309