Patent Assignment
Reel/Frame 062071/0903
Assignment of Assignor's Interest
Recorded: 2022-12-13
Pages: 6
Assignors
AHN, SANG HOON
Executed: 2022-11-22
OH, KYUNG SEOK
Executed: 2022-11-29
LEE, SEUNG-HEON
Executed: 2022-11-29
LIM, JUN HYUK
Executed: 2022-11-29
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method for Manufacturing the Same