Patent Assignment
Reel/Frame 062090/0903
Assignment of Assignor's Interest
Recorded: 2022-12-14
Pages: 2
Assignee
HITACHI HIGH-TECH CORPORATION
17-1, TORANOMON 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Plasma Processing Method and Manufacturing Method of Semiconductor Device