Patent Assignment
Reel/Frame 062102/0281
Assignment of Assignor's Interest
Recorded: 2022-12-15
Pages: 3
Assignors
FU, SHIH-KANG
Executed: 2020-05-18
LEE, MING-HAN
Executed: 2020-05-18
SHUE, SHAU-LIN
Executed: 2020-05-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Hybrid Method for Forming Semiconductor Interconnect Structure
Application:
18/066,464 →
Publication:
US 2023/0118565