Patent Assignment
Reel/Frame 062103/0650
Assignment of Assignor's Interest
Recorded: 2022-12-09
Pages: 66
Assignors
KAMIMURA, DAIGI
Executed: 2021-03-22
TANIYAMA, TOMOSHI
Executed: 2021-03-23
SHIRAKO, KENJI
Executed: 2021-03-22
SHIMADA, HIRONORI
Executed: 2021-03-22
HORII, AKIRA
Executed: 2021-03-22
NAKADA, TAKAYUKI
Executed: 2021-03-22
YAMASHIMA, NORIHIRO
Executed: 2021-03-26
Assignee
KOKUSAI ELECTRIC CORPORATION
3-4, KANDAKAJI-CHO, CHIYODA-KU, TOKYO, 101-0045, JAPAN
Covered Property
(1)
Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device, and Recording Medium