Patent Assignment
Reel/Frame 062107/0625
Assignment of Assignor's Interest
Recorded: 2022-12-15
Pages: 17
Assignors
HASHIMOTO, YOSHITOMO
Executed: 2022-03-08
NAKATANI, KIMIHIKO
Executed: 2022-03-08
WASEDA, TAKAYUKI
Executed: 2022-02-21
Assignee
KOKUSAI ELECTRIC CORPORATION
3-4, KANDAKAJI-CHO, CHIYODA-KU, TOKYO, 101-0045, JAPAN
Covered Property
(1)
Method of Processing Substrate, Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium