Patent Assignment
Reel/Frame 062109/0607
Assignment of Assignor's Interest
Recorded: 2022-12-15
Pages: 4
Assignors
LIN, SHIH-YAO
Executed: 2021-03-18
LEE, HSIAO WEN
Executed: 2021-05-09
KUO, LI-JUNG
Executed: 2021-03-18
CHEN, CHEN-PING
Executed: 2021-03-18
CHANG, MING-CHING
Executed: 2021-03-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Devices and Methods of Manufacturing Thereof