Patent Assignment
Reel/Frame 062118/0561
Assignment of Assignor's Interest
Recorded: 2022-12-16
Pages: 6
Assignors
LEE, CHUNG WOO
Executed: 2022-11-28
PARK, TAE DONG
Executed: 2022-11-24
PARK, CHANG JUN
Executed: 2022-11-23
KIM, JIN HWAN
Executed: 2022-11-24
Assignee
SEMES CO., LTD.
77, 4SANDAN 5-GIL, JIKSAN-EUP, SEOBUK-GU, CHEONAN-SI, CHUNGCHEONGNAM-DO, 31040, KOREA, REPUBLIC OF
Covered Property
(1)
Apparatus for Wafer Placement Teaching and Method for Wafer Placement Teaching Using the Same