Patent Assignment
Reel/Frame 062119/0553
Assignment of Assignor's Interest
Recorded: 2022-12-16
Pages: 3
Assignee
KOKUSAI ELECTRIC CORPORATION
3-4, KANDAKAJI-CHO, CHIYODA-KU, TOKYO, 1010045, JAPAN
Covered Properties
(2)
Substrate Processing Apparatus, Method of Processing Substrate, and Method of Manufacturing Semiconductor Device
Application:
18/082,044 →
Publication:
US 2023/0112057
Substrate Processing Apparatus and Method of Manufacturing Semiconductor Device