Patent Assignment
Reel/Frame 062126/0737
Assignment of Assignor's Interest
Recorded: 2022-12-16
Pages: 6
Assignors
LIN, WUN-JIAN
Executed: 2022-10-31
YEH, SHIH-HUANG
Executed: 2022-10-31
HSU, CHEN-HAO
Executed: 2022-10-31
Assignee
MEDIATEK INC.
NO. 1, DUSING 1ST RD., HSINCHU SCIENCE PARK, HSINCHU CITY, 30078, TAIWAN
Covered Property
(1)
Semiconductor Package Structure Having Antenna Array
Application:
18/067,221 →
Publication:
US 2023/0207499