Patent Assignment
Reel/Frame 062139/0425
Assignment of Assignor's Interest
Recorded: 2022-12-19
Pages: 3
Assignee
MEDIATEK INC.
NO. 1, DUSING 1ST RD., HSINCHU SCIENCE PARK, HSINCHU CITY, 30078, TAIWAN
Covered Property
(1)
Semiconductor Structure and Method for Forming the Same