Patent Assignment
Reel/Frame 062148/0832
Assignment of Assignor's Interest
Recorded: 2022-12-16
Pages: 5
Assignors
KO, BYUNG HOON
Executed: 2022-12-15
NOH, SEUNG WOO
Executed: 2022-12-15
PARK, SANG YUN
Executed: 2022-12-15
CHOI, JIN WOO
Executed: 2022-12-15
KIM, YOUN HO
Executed: 2022-12-15
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Wafer Type Sensor, Wafer Alignment Method Using the Same, and Calibration Device for Calibrating Wafer Type Sensor