Patent Assignment
Reel/Frame 062163/0709
Assignment of Assignor's Interest
Recorded: 2022-12-20
Pages: 5
Assignors
POWER, DAVID
Executed: 2022-11-20
CONKLIN, DAVID
Executed: 2022-12-07
SCHEPIS, ANTHONY
Executed: 2022-11-29
WELOTH, ANDREW
Executed: 2022-11-21
DEVILLIERS, ANTON
Executed: 2022-12-15
Assignee
TOKYO ELECTRON LIMITED
AKASAKA BIZ TOWER, 3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Apparatus and Method for Wafer Alignment