Patent Assignment
Reel/Frame 062179/0202
Assignment of Assignor's Interest
Recorded: 2022-12-22
Pages: 4
Assignors
LEE, JUNG WON
Executed: 2022-11-30
PARK, JU EOK
Executed: 2022-11-30
KANG, IN SOO
Executed: 2022-11-30
Assignee
NEPES CO., LTD.
105, GEUMIL-RO 965BEON-GIL, SAMSEONG-MYEON, EUMSEONG-GUN, 27651, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including Antenna and Method of Manufacturing the Semiconductor Package
Application:
18/145,047 →
Publication:
US 2023/0216201