Assignment of Assignor's Interest

Recorded: 2022-12-23 Pages: 5

Assignors

KATO, YOSHITAKA

Executed: 2022-12-08

ENDO, TAKESHI

Executed: 2022-12-08

TSURUTA, KAZUHIRO

Executed: 2022-12-15

Assignees

DENSO CORPORATION

1-1, SHOWA-CHO, KARIYA-CITY, AICHI-PREF., 448-8661, JAPAN

TOYOTA JIDOSHA KABUSHIKI KAISHA

1, TOYOTA-CHO, TOYOTA-SHI, AICHI-KEN, 471-8571, JAPAN

MIRISE TECHNOLOGIES CORPORATION

500-1 MINAMIYAMA, KOMENOKI-CHO, NISSHIN-SHI, AICHI-KEN, 470-0111, JAPAN

Covered Property (1)

Circuit module having reinforcing bonding materials, and a method of manufacturing the same

Application: 18/145,949 →

Publication: US 2023/0326845