Patent Assignment
Reel/Frame 062195/0039
Assignment of Assignor's Interest
Recorded: 2022-12-23
Pages: 3
Assignors
TSAO, CHIA-WEN
Executed: 2022-11-22
HSIEH, WEN-CHEN
Executed: 2022-11-22
TSAI, YI-LIN
Executed: 2022-11-22
CHIEN, HSIU-FANG
Executed: 2022-11-22
Assignee
SILICONWARE PRECISION INDUSTRIES CO., LTD.
NO.123, SEC. 3, DAFENG RD., TAICHUNG CITY, TAIWAN
Covered Property
(1)
Electronic Package and Manufacturing Method Thereof, and Substrate Structure