IP Library › Assignment 062208/0729
Patent Assignment
Reel/Frame 062208/0729

Change of Address

Recorded: 2022-12-22 Pages: 2
Assignor
Assignee
SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
NO.6, LIANHUI STREET, XINXING SUB-DISTRICT, BINJIANG DISTRICT, HANGZHOU CITY, ZHEJIANG PROVINCE, 310051, CHINA
Covered Property (1)
Chip Package Assembly And Method For Manufacturing The Same
Application: 16/248,069 →
Publication: US 2019/0229043
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 15, 2019
From: CHEN, SHIJIE
To: SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
Reel/Frame 048013/0475 →
Change of Address Mar 2, 2023
From: CHEN, SHIJIE
To: SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
Reel/Frame 063648/0380 →