Patent Assignment
Reel/Frame 062248/0731
Assignment of Assignor's Interest
Recorded: 2022-12-31
Pages: 5
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Chip-On-Film Semiconductor Package and Display Apparatus Including the Same
Application:
18/092,241 →
Publication:
US 2023/0326930