IP Library › Assignment 062263/0194
Patent Assignment
Reel/Frame 062263/0194

Assignment of Assignor's Interest

Recorded: 2023-01-03 Pages: 2
Assignor
DEGUCHI, YASUNORI
Executed: 2022-12-20
Assignee
TOHO KASEI CO., LTD.
6-2, IMAGO-CHO, YAMATOKORIYAMA-SHI, NARA, 639-1031, JAPAN
Covered Property (1)
Substrate Processing Module, Substrate Processing Apparatus, and Substrate Manufacturing Method
Application: 18/004,144 →
Publication: US 2023/0256478
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 8, 2024
From: TOHO KASEI CO., LTD.
To: DAIKIN FINETECH, LTD.
Reel/Frame 066705/0170 →