Patent Assignment
Reel/Frame 062263/0519
Assignment of Assignor's Interest
Recorded: 2023-01-03
Pages: 8
Assignors
SEJIMA, KOICHI
Executed: 2022-12-13
FUKATANI, TAKASHI
Executed: 2022-12-09
NISHIO, KENYA
Executed: 2022-12-09
HANEDA, MASAKI
Executed: 2022-12-06
FUJII, NOBUTOSHI
Executed: 2022-12-06
SAITO, SUGURU
Executed: 2022-12-06
Assignee
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
4-14-1 ASAHI-CHO, ATSUGI-SHI, KANAGAWA, 2430014, JAPAN
Covered Property
(1)
Wiring Structure, Method of Manufacturing the Same, and Imaging Device