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Patent Assignment
Reel/Frame 062271/0206

Assignment of Assignor's Interest

Recorded: 2023-01-04 Pages: 4
Assignor
KANG, NAI-YUAN
Executed: 2022-12-29
Assignee
REALTEK SEMICONDUCTOR CORP.
NO.2, INNOVATION RD. II, HSINCHU SCIENCE PARK, HSINCHU, 30076, TAIWAN
Covered Property (1)
Usb Chip and Operation Method Thereof
Application: 18/092,680 →
Publication: US 2023/0222084