Patent Assignment
Reel/Frame 062272/0030
Assignment of Assignor's Interest
Recorded: 2023-01-04
Pages: 4
Assignors
HUNG, WENSEN
Executed: 2022-08-29
CHEN, TSUNG-YU
Executed: 2022-08-29
WEI, WEN-HSIN
Executed: 2022-08-29
HU, HSIEN-PIN
Executed: 2022-08-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Packages and Methods of Forming the Same
Application:
18/149,793 →
Publication:
US 2024/0088093