Patent Assignment
Reel/Frame 062277/0209
Assignment of Assignor's Interest
Recorded: 2023-01-04
Pages: 3
Assignors
KAO, MIN-FENG
Executed: 2022-12-12
YAUNG, DUN-NIAN
Executed: 2022-12-26
LIN, HSING-CHIH
Executed: 2022-12-08
LIU, JEN-CHENG
Executed: 2022-12-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Method for Forming Semiconductor Structure Including Capacitor
Application:
18/150,184 →
Publication:
US 2024/0222261